Conformal Coating Electronic Assembly

Provides economical protection from moist, humid environments and resists chemicals, fuels, and solvents. Enhances the reliability of circuitry.

Materials available include urethanes, acrylics, epoxies and silicones.

Modern low air volume spray equipment is usually employed to apply conformal coating materials. Separate spray facilities are used to prevent contamination by incompatible materials. Process temperature, humidity, and mix viscosity are carefully controlled to ensure consistent results. Brush and dip application is also offered.

Bonding Electronic Assembly

Epoxy materials or RTVs are often specified by OEMs to secure large parts to the circuit board, especially if the electronic assembly will be subjected to continued vibration.

Potting Electronic Assembly

Potting is the immersion of the circuit in a bulk material using a removable or fixed mold.
Several potting materials can be selected by the OEM depending on the characteristics desired such as moisture or chemical resistance or protection from high voltage breakdown.

 

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