The A.P.E. Bandit SMD-7500 combines precision visual alignment with top and bottom preheat reflow for complete rework processing of SMT, BGA and Chip-Scale components. It’s split vision alignment utilizes the latest technology in optical engineering alignment and design. It provides absolute control in positioning all ultra-fine pitch QFP, CSP and BGA components, together with large ceramic or plastic BGA devices.

An operator may remove a defective component, accurately position a replacement component within an accuracy of +/-0.001, and safely solder attach that new component to the PCB. The ability to preset positioning parameters, as well as to create and store complex thermal profiles, ensures precise repeatable processing and a robust process, component after component, and board after board.